INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY

Pittsburgh, Pennsylvania, 15234 United States

Mission Statement

The Foundation's role is to support student activities related to the study of Microelectronic Packaging, Interconnect and Assembly.

About This Cause

The Microelectronics Foundation supports student activities that cultivate an understanding of packaging, components, and assembly technologies; how they are used; and understanding materials used in the processes. To promote these activities, the Foundation sponsors: technical paper and poster contest awards at various chapter and national level conferences and workshops; and student design competitions. The Foundation also diversity, equity and inclusion (DEI) initiatives through DEI presentation grants. The IMAPS Student DEI Presentation Grant is an annual opportunity designed to recognize and support outstanding student presenters from underrepresented groups. This grant aims to foster diversity, equity, and inclusion within the field of technology and to provide financial assistance to deserving students. The Foundation will also promote the formation of student chapters at suitable/appropriate/aligned institutions.

INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY
Po Box 14727
Pittsburgh, Pennsylvania 15234
United States
Phone 919-293-5000
Unique Identifier 541392712